主要研究方向是功率/射频集成电路设计，包括全集成隔离电源芯片、硅基毫米波雷达收发芯片、CMOS功率放大器芯片和高速数字隔离器等。主持多项国家自然科学基金项目、博士后科学基金和企业攻关项目等。在国际会议和期刊上发表论文20多篇，其中第一作者发表集成电路设计领域顶级会议ISSCC和顶级期刊JSSC论文共3篇，以及IEEE TCAS-I/II、CICC、ESSCIRC和IEEE MWTL等。担任IEEE JSSC、TCAS-I/II、IEEE MWTL等国际知名期刊和会议审稿人。

• 2014.09-2019.11 中国科学技术大学 电子科学与技术专业硕博连读 工学博士

• 2018.06-2019.06 美国南卫理公会大学（SMU） 电子工程系 访问学者

• 2019.11-2022.1 中国科学技术大学永利69193com 博士后

• D. Pan, A. Li, W. Sun and L. Cheng, An Isolated DC–DC Converter Using a Cross-Coupled Shoot-Through-Free Class-D Oscillator With Low EMI Emissions, in IEEE Journal of Solid-State Circuits (JSSC), doi: 10.1109/JSSC.2024.3407599.

• X. Zhang, B. Deng, L. Sun, D. Pan^* and L. Cheng, A W-Band 0.18-dB RMS Gain and 0.97º Phase Error Active Phase Shifter in 28-nm CMOS, in IEEE Microwave and Wireless Technology Letters (MWTL), doi: 10.1109/LMWT.2024.3398796.

• D. Pan, G. Li, F. Miao, W. Sun, X. Gong, L. Zhang, L. Cheng. A 1.2W 51%-Peak-Efficiency Isolated DC-DC Converter with a Cross-Coupled Shoot-Through-Free Class-D Oscillator Meeting the CISPR-32 Class-B EMI Standard, 2022 IEEE International Solid- State Circuits Conference (ISSCC), San Francisco, CA, USA, 2022. pp. 240-242.

• D. Pan, G. Li, F. Miao, B. Deng, J. Wei, D. Yu, M. Liu, L. Cheng. 33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density, 2021 IEEE International Solid- State Circuits Conference (ISSCC), San Francisco, CA, USA, 2021, pp. 468-470. (First ISSCC paper from USTC)

• D. Pan, Z. Duan; B. Wu; Y. Wang; D. Huang; Y. Wang; L. Sun; P. Gui; L. Cheng. A 76–81-GHz Four-Channel Digitally Controlled CMOS Receiver for Automotive Radars[J], in IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 68, no. 3, pp. 1091-1101, March 2021.

• D. Pan et al., “A 77-GHz Power Amplifier With Digital Power Control for Multi-Mode Automotive Radar in 28-nm Bulk CMOS,” IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), vol. 70, no. 3, pp. 875–879, 2023.